April 2024 | Hong Kong — The Hong Kong Productivity Council (HKPC) and JinTech Semiconductor have signed a Memorandum of Understanding (MoU) to jointly advance the semiconductor industry through cutting-edge technology and talent development.
The collaboration marks a major milestone in promoting smart microelectronics manufacturing in Hong Kong. Leveraging HKPC’s strengths in Industry 4.0 technologies—including AI, robotics, and image-based human-machine interfaces—the parties will co-create an automated smart micro-factory, enabling highly localised, scalable, and intelligent production of semiconductor components.
JinTech Semiconductor has committed to investing US$10 million over the next five years, aiming to exceed US$500 million in annual output value by 2027. The company also plans to expand its local team by recruiting and training new I&T talent to support Hong Kong’s growing semiconductor ecosystem.
This strategic partnership is set to enhance the city’s manufacturing capabilities, elevate its position in global microelectronics, and accelerate the development of a resilient, innovation-led industrial chain.