April 2024 | Hong Kong — The Hong Kong Productivity Council (HKPC) and JinTech Semiconductor Limited have officially signed a Memorandum of Understanding (MoU), marking a strategic partnership to promote innovation, industrialisation, and talent development in Hong Kong’s semiconductor industry.

This milestone collaboration delivers two industry “firsts”:

• It is HKPC’s first cross-disciplinary partnership focused on smart microelectronics manufacturing.
• JinTech Semiconductor becomes the first semiconductor testing company to establish operations in Hong Kong.

Leveraging HKPC’s leading-edge technologies and JinTech’s expertise in memory wafer testing and storage-grade packaging, the two parties will co-develop a customised, sustainable “Microfactory” model tailored for Hong Kong. This initiative aims to drive smart manufacturing in die grading and packaging, while advancing workforce training and industrial innovation.

“This partnership represents a powerful synergy between applied R&D and commercial execution,” noted the JinTech leadership team. “Together, we will help shape Hong Kong into a hub for high-quality semiconductor production.”

The collaboration is expected to accelerate Hong Kong’s transformation into a world-class I&T centre and smart city, contributing to the city’s vision for new productive forces and industrial upgrading.