Overview

The JinTech BGA NAND Flash Series offers compact, high-performance embedded memory for a wide range of consumer, industrial, and automotive applications. Designed for direct PCB integration, these BGA (Ball Grid Array) packaged NAND chips deliver excellent read/write stability, long data retention, and low power consumption — ideal for next-generation smart devices and embedded systems.

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Key Features

• Package Type: BGA 63 / 132 / 153 / 291 (depending on density)
• Capacities: 8 Gb – 1 Tb
• NAND Type: 3D TLC / QLC (optional pSLC for industrial use)
• Interface Options:
  • Toggle DDR / ONFI 4.1 compliant
  • x8 / x16 bus width support
• Performance:
  • Read Speed: Up to 800 MB/s
  • Write Speed: Up to 600 MB/s
• Operating Temperature:
  • Commercial: 0 °C – 70 °C
  • Industrial: –40 °C – 85 °C
• Endurance: 3K–10K P/E cycles (configurable by grade)
• ECC & Reliability: Built-in ECC engine, wear leveling, bad-block management, and read-disturb protection

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Applications

• Smartphones and tablets
• Set-top boxes and smart TVs
• Industrial PCs and single-board computers
• Networking and telecommunication equipment
• Automotive infotainment and ADAS systems

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Advantages

Supports JinTech wafer-level testing and full traceability

Compact BGA package for space-efficient PCB design

High-performance interface with flexible bus options

Long-term data retention and high endurance

Compatible with major NAND controllers and SoCs